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US Patent Issued to Intel on Nov. 3 for "Package architectures with heterogeneous integration of various device thicknesses" (Arizona Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,762, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Package architectures with heterogeneous integration of various d... और पढ़ें


US Patent Issued to DENSO on Nov. 3 for "Semiconductor module and power module including the same" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,763, issued on Nov. 3, was assigned to DENSO Corp. (Kariya, Japan). "Semiconductor module and power module including the same" was invented ... और पढ़ें


US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Nov. 3 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,764, issued on Nov. 3, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufactur... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on Nov. 3 for "Package structure including heat sink structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,765, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Package structure including heat sink structure an... और पढ़ें


US Patent Issued to AMD DESIGN on Nov. 3 for "Heat sink with heat pipe handle portion" (New Jersey, Washington Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,766, issued on Nov. 3, was assigned to AMD DESIGN LLC (Wilmington, Del.). "Heat sink with heat pipe handle portion" was invented by Sruti Ch... और पढ़ें


US Patent Issued to DENSO International America, DENSO on Nov. 3 for "Emitters for integrated power card cooling" (Canadian, American Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,767, issued on Nov. 3, was assigned to DENSO International America Inc. (Southfield, Mich.) and DENSO Corp. (Kariya-city, Japan). "Emitters ... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor packaging having thermal interfacial material film including epoxy and liquid metal filler" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,768, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packaging having thermal interfa... और पढ़ें


US Patent Issued to ARIECA on Nov. 3 for "Method of manufacture of a thermal interface material, a thermal interface material formed therefrom, and an integrated circuit formed therefrom" (Pennsylvania, Connecticut Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,769, issued on Nov. 3, was assigned to ARIECA INC. (Pittsburgh). "Method of manufacture of a thermal interface material, a thermal interface... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,770, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of fabricatin... और पढ़ें


US Patent Issued to AMOSENSE on Nov. 3 for "Inverter power module" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,771, issued on Nov. 3, was assigned to AMOSENSE Co. LTD. (Cheonan-si, South Korea). "Inverter power module" was invented by Kyungwhan Woo (C... और पढ़ें